Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Joakim Fagerlund

#13841

outgasing (silver-glass) | 14 October, 1998

We have problems with achiveing a void free soldered joint when we seal different kind of packages (QFP,LCC and PGA) We think the problem partly is due to outgasing from the die-adhesive (silver-glass) Does anybody have any reccomendations what to do ? Maybee: A new kind of die adhesive ? Longer bake-out time and/or higher temperatures ? Best regards Joakim

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