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SMT electronics assembly manufacturing forum.


Component Packaging Trends

Joseph Belmonte

#13797

Component Packaging Trends | 15 October, 1998

Hi Folks, As I travel our industry it seems to me the trend is to move from finner and finner pitch QFP's to array packages (BGA's, CSP's, etc.). Do you folks see the same trend? What is the finest pitch QFP package you have used in your process? Are you using or considering using Chip Scale Packages? Anyone considering 0201 chip componets? I feel using array packages will provide a much more robust process. The issue of not seeing the solder joints should be solved by propoer process development and control. Also the high end printing equipment can verify solder paste on each of the BGA or CSP pads prior to the printed board leaving the stencil. Thanks to all the provide info!!!

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Justin Medernach

#13798

Re: Component Packaging Trends | 15 October, 1998

| Hi Folks, | As I travel our industry it seems to me the trend is to move from finner and finner pitch QFP's to array packages (BGA's, CSP's, etc.). Do you folks see the same trend? What is the finest pitch QFP package you have used in your process? Are you using or considering using Chip Scale Packages? Anyone considering 0201 chip componets? | I feel using array packages will provide a much more robust process. The issue of not seeing the solder joints should be solved by propoer process development and control. Also the high end printing equipment can verify solder paste on each of the BGA or CSP pads prior to the printed board leaving the stencil. | Thanks to all the provide info!!! | Joe, What's happening?? How have you been? I'm at Flextronics International now, up in Westford. I'm the only Mfg. guy in this PIC. I only work on the latest and greatest. Yes, you are correct, there is definitely an increase in the usage of BGA / CSP. We do a lot of work with .016" pitch. Hardly any .012". Too easy to err in process. We have done qualifications on CSP but I haven't gotten any in live product yet. Tons of BGA work though. 0201's are definitely in the pipeline. Talk to Big Jon about it. Murata is at the forefront. A couple of little guys out there are using 'em too and I'm sure some of the commercial electronics guys in the orient have been using them. The problem with 0201's is pick reliability. Nobody has it DOWN. Siemens says this, Fuji says that, KME actually does it, but the reality is that operators, not engineers run the lines. I can set up a line to pick up fly turds but that doesn't mean that my operators can or have the time to do it. Another problem is the application of these things and the on-board inspection that you're talking about. It's too damn slow for this kind of production. I know MPM has done a lot of work on their inspection systems but turning a screen printer into a gate because you're running a line with 2 chipshooters running at 42k cph and three fine pitch mounters with 15 second cycle times isn't an option in the world of commercial electronics production. Know what I mean? What good is a sub-10 second recognition and print time on a printer equipped with 2D / 3D verification when using the verification is going to jump the cycle time to at least 20 seconds if I inspect every pad??? I think a reliable 0201 process is a long way away. (5 or 6 days or so, in this industry) BGA is here to stay and it's only gonna grow. The biggest growth is going to be in CSPs, as long as there is no underfill, like flip chips. I don't think those things are going anywhere. I really don't care what crap the component mfr's push at us. they just want to lose the package and sell the product. Of coarse, they are going to tell us that Flip chip is the next big thing......

Regards, Justin Medernach

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Joe Belmonte

#13799

Re: Component Packaging Trends | 16 October, 1998

| | Hi Folks, | | As I travel our industry it seems to me the trend is to move from finner and finner pitch QFP's to array packages (BGA's, CSP's, etc.). Do you folks see the same trend? What is the finest pitch QFP package you have used in your process? Are you using or considering using Chip Scale Packages? Anyone considering 0201 chip componets? | | I feel using array packages will provide a much more robust process. The issue of not seeing the solder joints should be solved by propoer process development and control. Also the high end printing equipment can verify solder paste on each of the BGA or CSP pads prior to the printed board leaving the stencil. | | Thanks to all the provide info!!! | | | Joe, | What's happening?? How have you been? I'm at Flextronics International now, up in Westford. I'm the only Mfg. guy in this PIC. I only work on the latest and greatest. Yes, you are correct, there is definitely an increase in the usage of BGA / CSP. We do a lot of work with .016" pitch. Hardly any .012". Too easy to err in process. We have done qualifications on CSP but I haven't gotten any in live product yet. Tons of BGA work though. 0201's are definitely in the pipeline. Talk to Big Jon about it. Murata is at the forefront. A couple of little guys out there are using 'em too and I'm sure some of the commercial electronics guys in the orient have been using them. The problem with 0201's is pick reliability. Nobody has it DOWN. Siemens says this, Fuji says that, KME actually does it, but the reality is that operators, not engineers run the lines. I can set up a line to pick up fly turds but that doesn't mean that my operators can or have the time to do it. Another problem is the application of these things and the on-board inspection that you're talking about. It's too damn slow for this kind of production. I know MPM has done a lot of work on their inspection systems but turning a screen printer into a gate because you're running a line with 2 chipshooters running at 42k cph and three fine pitch mounters with 15 second cycle times isn't an option in the world of commercial electronics production. Know what I mean? What good is a sub-10 second recognition and print time on a printer equipped with 2D / 3D verification when using the verification is going to jump the cycle time to at least 20 seconds if I inspect every pad??? I think a reliable 0201 process is a long way away. (5 or 6 days or so, in this industry) BGA is here to stay and it's only gonna grow. The biggest growth is going to be in CSPs, as long as there is no underfill, like flip chips. I don't think those things are going anywhere. I really don't care what crap the component mfr's push at us. they just want to lose the package and sell the product. Of coarse, they are going to tell us that Flip chip is the next big thing...... | | Regards, | Justin Medernach

Justin, Thanks for the input. Glad to see things are going well for you!! It sounds like you are seeing the same trends as I. Being on the supplier end of our business for the last three years after many years on the customer side gives me the opportunity to visit many facilities and see what direction people are moving in and how they run thier process. This forum should include a regular discussion on where people see SMT packaging going since this will have major influence on how we design our processes, select equipment, etc. I agree on flip chips. Any package that will require a SSP (Slow Secondary Process) such as underfill and/or encapsulant will only be used in certain products. I feel we will see the continued growth of BGA's and CSP's that can be assembled in a "standard" SMT process. Keep in touch. Best Regards, Joe Belmonte |

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