Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

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SMT electronics assembly manufacturing forum.


Passivation Issues

Susan mcbirdie

#13442

Passivation Issues | 19 November, 1998

Hello Everybody

I am new to the electronics packaging arena, please be patient with me... I have a few questions regarding the various passivation used on the silicon dice. I would really appreciate if you guys could provide me with more information about the following

1. Is there any known difference between the resilience of polyimide passivation and the widely used nitride passivation. In other words is the polyimide passivation less sensitive to scratch damages.

2. Known difference in adhesion of the polyimide and the nitride passivation to different underfill materials.

3. Known difference in moisture absorption characteristics of the passivation materials.

4. Any other known differences

5. What would be the other passivation material widely used in the industry.

I am in urgent need of the above information. Any help would be greatly appreciated.

Regards Susan

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Earl Moon

#13443

Re: Passivation Issues | 19 November, 1998

| Hello Everybody | | I am new to the electronics packaging arena, please be patient with me... I have a few questions regarding the various passivation used on the silicon dice. I would really appreciate if you guys could provide me with more information about the following | | 1. Is there any known difference between the resilience of polyimide passivation and the widely used nitride passivation. In other words is the polyimide passivation less sensitive to scratch damages. | | 2. Known difference in adhesion of the polyimide and the nitride passivation to different underfill materials. | | 3. Known difference in moisture absorption characteristics of the passivation materials. | | | 4. Any other known differences | | 5. What would be the other passivation material widely used in the industry. | | | I am in urgent need of the above information. Any help would be greatly appreciated. | | Regards | Susan | For being so new, you ask great/old questions. I have one as I am not entirely visualizing your requirement. Passivation for what purpose beyond adhesion? Did I answer my question?

As far as moisture ad/absorbtion, polyimide sucks water easily and quickly to a specific volume requiring a bake cycle to remove it within a specific period before processing. Therefore, it is less resilient to moisture. Equally, it scratches easily but what doesn't unless handled properly.

Pleas tell us more,

Earl Moon

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