Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


decapsulation

trien pham

#13412

decapsulation | 24 November, 1998

I have a COB device that I need to decapsulate for failure analysis.

I would like to find out how I can do it using common materials/process that I can easily find.

Thank you and I look forward to hearing from you soon.

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Dave F

#13413

Re: decapsulation | 30 November, 1998

| I have a COB device that I need to decapsulate for failure analysis. | | I would like to find out how I can do it using common materials/process that I can easily find. | | Thank you and I look forward to hearing from you soon. | Trien: Levels of sophistication are:

1 Plasma decapsulator: Nippon Scientific 2 Solvent drip machine: B&G Enterprises (B&G Decapsulator Model 250) 2880 Research Park Drive, Suite 100 Soquel, CA 95073 408-464-6540 3 Solvents: Masterbond Hackensaack, NJ 201-343-8983 Chemtronics 770 424 4888 Dynaloy (URESOLVE & DYNASOLVE) 7 Great Meadows Ln East Hanover NJ 973-887-9270 fax3678 Dynaloy Co Indianapolis IN 800-669-5790

Good Luck

Dave F

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