Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Ron Costa

#13287

FST Dexcoat White tin plating | 13 December, 1998

Has anyone had any experience with using this alternative plating process? Some board houses are pushing toward this plating. Is there any long term data on this process? Any problems experienced with smt and thru-hole? I've heard tin whiskers to be a problem but i'm told that this Dexcoat process eliminates whisker growth. Any information on white tin plating would be helpful.

Thanks, Ron

reply »

Earl Moon

#13288

Re: FST Dexcoat White tin plating | 14 December, 1998

| Has anyone had any experience with using this alternative plating process? Some board houses are pushing toward this plating. Is there any long term data on this process? Any problems experienced with smt and thru-hole? I've heard tin whiskers to be a problem but i'm told that this Dexcoat process eliminates whisker growth. | Any information on white tin plating would be helpful. | | Thanks, Ron |

This is yet another solder termination area coating alternative (to HASL, OSP'S, or whatever). There are heated discussions in past sessions herin, but most discussions are in the IPC TechNet Archives.

There are but a few fabrication capabilities using this process. One in Florida seems to push it hardest in this country. I think its name is Omikron, or something close.

It is said, the chief advantage over "grey" tin is not so much whisker growth minimization as oxidation reduction and longer shelf life. I too and waiting for long term studies, but really am not anxious to jump on the band wagon for another tin rally. I want the same surface everyone wants - one that is solderable, flat, has long shelf life, exhibits high initial quality and long term reliability.

Earl Moon

reply »

PCB equipment

Heller Industries Mark 5获得了 2015年中国SMT远见奖 - 回焊炉领域