| Has any anyone established / published quality standards for BGA solder joints? Is IPC-A-610 in process of adding standards for BGAs? | The debate continues. I have felt for some time a maximum 20% voiding is allowable under certain conditions (where, proximity to each other, individual and collective volume, etc.). Many others seem to be ascribing to this allowance using whatever means (grey scale or high resolution black/white x-ray in combination with x-sectioning) on a sample level basis to ensure process capability determination and continuous process improvment as well as identifying cause and effect relationships (what's in the voids and how to prevent it from being there through better process management - from design through acceptance).
Lot's of stuff pending at IPC and their archives provide some evidence of this. I have worked to develop standards for initial quality findings as well as HALT/HAST testing to provide long term solder joint reliability evidence.