Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Handling of moisture sensitive IC's

Brian Gurney

#13190

Handling of moisture sensitive IC's | 28 December, 1998

Looking for additional handling and baking information of moisture sensitive IC'c beyond/or inadditotn to IPC - SM - 786 A. Publications, guidelines, baking experience.

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Earl Moon

#13191

Re: Handling of moisture sensitive IC's | 28 December, 1998

| Looking for additional handling and baking information of moisture sensitive IC'c beyond/or inadditotn to IPC - SM - 786 A. Publications, guidelines, baking experience. | Much depends on your environmental controls and those of your suppliers. PBGA moisture sensitivity is of special concern.

Many of those practicing process management use a pre-bake cycle of 250 degrees F. for up to 4 hours (for boards and components). Then, storage is maintained in an inert atmosphers (N2) until assembly. Dessicants also may be specified for shipment and upon receipt. I know of several assembly operations using no environmental controls. Some make it, some don't. And on it goes.

Earl Moon

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