Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

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OA core solder stranded wires

Tracy Hille

#13130

OA core solder stranded wires | 4 January, 1999

I am looking for information regarding post wave soldering of stranded wires into a circuit board using OA core wire solder. We do a final pass thru the cleaner after the hand soldering but I'm concerned about any OA flux residue that may have wicked up the strands of the wire under the insulation. Looking for articles or technical ref. material or personal history stories.

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Dave F

#13131

Re: OA core solder stranded wires | 5 January, 1999

| I am looking for information regarding post wave soldering of stranded wires into a circuit board using OA core wire solder. We do a final pass thru the cleaner after the hand soldering but I'm concerned about any OA flux residue that may have wicked up the strands of the wire under the insulation. Looking for articles or technical ref. material or personal history stories. | | Tracy: An excerpt from our solder control procedure that applies to your question follows:

4.3 Tinning of Conductors

4.3.1 Operators use solder pots set to 245�5�C (473�9�F) for hand tinning.

4.3.2 Operators may use liquid flux. Operators apply flux so that it does not flow under the insulation except for traces carried by wicking.

4.3.3 Operators tin the portion of stranded or solid conductors or part leads that will eventually become a part of the finished solder connection with solder and cleaned prior to attachment. Immersion of conductors in a solder bath shall not exceed 5 seconds.

4.3.4 Hot tinning of solid conductors and part leads should not extend closer than 0.5 mm (0.020 inch) to part bodies, end seals, or insulation unless the part configuration and mounting configuration dictate. If closer tinning is required, the part body, end seals, or insulation shall be inspected for damage after tinning.

4.3.5 Operators remove gold plating on all surfaces that become part of finished solder connections by tinning and soldering operations.

CAUTION: Pretinning and gold removal operations shall be performed in such a way that immersion of part leads into the liquid solder does not cause the part lead and package to become heated beyond the maximum temperature and time permitted by the individual component specification.

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