Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Jason Tomlinson

#13045

20 mil pitch applications | 8 January, 1999

Our company is beginning to delve into some 20 mil applications and I'm curious to hear what kind of success others have had placing these components. What kind of fall out rates we might expect or any specific difficulties encountered and what actions might have been taken to overcome them. Any input would be much appreciated.

Thank you, Jason Tomlinson

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Earl Moon

#13046

Re: 20 mil pitch applications | 8 January, 1999

| Our company is beginning to delve into some 20 mil applications and I'm curious to hear what kind of success others have had placing these components. What kind of fall out rates we might expect or any specific difficulties encountered and what actions might have been taken to overcome them. Any input would be much appreciated. | | Thank you, | Jason Tomlinson | Jason,

Everyone's doing it now. Most of us started doing it in high school. Oops, that's another story.

The technology has been around for some time. I started with Cray/Amdahl in 1990 and haven't looked back provided the designs and processes are right. I mean you have to start at the begining and ensure concurrence all the way through each process.

The alternative to fine pitch QFP component types, almost automatically spelled pitch with a b (inappropriate to say I've known some?), is BGA. It takes up far less real estate and does the same job maybe even more reliably - depending on applications and process management.

The question is where are you now with designs and processes? and where do you need to be. The folks on this forum have done it all and will lend more assistance than this small offering.

Earl Moon

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Jason

#13047

Re: 20 mil pitch applications | 12 January, 1999

| | Our company is beginning to delve into some 20 mil applications and I'm curious to hear what kind of success others have had placing these components. What kind of fall out rates we might expect or any specific difficulties encountered and what actions might have been taken to overcome them. Any input would be much appreciated. | | | | Thank you, | | Jason Tomlinson | | | Jason, | | Everyone's doing it now. Most of us started doing it in high school. Oops, that's another story. | | The technology has been around for some time. I started with Cray/Amdahl in 1990 and haven't looked back provided the designs and processes are right. I mean you have to start at the begining and ensure concurrence all the way through each process. | | The alternative to fine pitch QFP component types, almost automatically spelled pitch with a b (inappropriate to say I've known some?), is BGA. It takes up far less real estate and does the same job maybe even more reliably - depending on applications and process management. | | The question is where are you now with designs and processes? and where do you need to be. The folks on this forum have done it all and will lend more assistance than this small offering. | | Earl Moon | Jason, The only suggestion I have for you is to experiment with pad and stencil apperature sizes to find what best fits your process. You might beable to dig up some more info through IPC, AMTX, Alphametals, or similar vendors. 20mil is fairly stright forward and I think you'll be able to handle it with no prob. I wouldn't panic until one of your design guys throw a 10mil 265 pin QFP at you.

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