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Lead Free Solder used in BGA

Kelvin Chow

#13035

Lead Free Solder used in BGA | 11 January, 1999

Some of my friends ask me if sombody use lead free solder ball on BGA, espically PBGA packages. I wonder if 96.5Sn/3.5Ag (m.p .221 oC) or 58Bi/42Sn (m.p. 138 oC) would be suitable candidates? Do you have any experience on this subject?

Kelvin

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Ross Berntson

#13036

Re: Lead Free Solder used in BGA | 12 January, 1999

| Some of my friends ask me if sombody use lead free solder ball on BGA, espically PBGA packages. I wonder if 96.5Sn/3.5Ag (m.p .221 oC) or 58Bi/42Sn (m.p. 138 oC) would be suitable candidates? Do you have any experience on this subject? | | Kelvin | Some people are studying these applications. Limited information is currently available for general dissemination, unfortunately.

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Earl Moon

#13037

Re: Lead Free Solder used in BGA | 14 January, 1999

| | Some of my friends ask me if sombody use lead free solder ball on BGA, espically PBGA packages. I wonder if 96.5Sn/3.5Ag (m.p .221 oC) or 58Bi/42Sn (m.p. 138 oC) would be suitable candidates? Do you have any experience on this subject? | | | | Kelvin | | | Some people are studying these applications. Limited information is currently available for general dissemination, unfortunately. |

This is done, of course, using high temperature solder balls. This is reasonable, as would be expected, as limited problems, so far, exist considering different metallurgical compositions and possible resulting long term solder joint reliability effects. This is where the main study is focused notwithstanding concerning the use of lead free solder in any other application.

Earl Moon

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