Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


E. R.

#12916

Re-Balling BGA and BGA sockets | 15 January, 1999

Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then processed through a reflow (oven). After reflow, the BGA is placed in water and the paper containing the balls is pulled away from the component, resulting in a reballed BGA.

Is this product available on the market or is it a proprietary type design ??

Any information pertaining to this item or any other suggestions on BGA re-balling made easy, would be greatly appreciated. If there are any posted articles that you could direct me too, just indicate a ball-park time frame of the posting and I will search it out .

Sincerely, Eric R.

ericr@nj.tanon.com

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Dave F

#12917

Re: Re-Balling BGA and BGA sockets | 15 January, 1999

| Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then processed through a reflow (oven). After reflow, the BGA is placed in water and the paper containing the balls is pulled away from the component, resulting in a reballed BGA. | | Is this product available on the market or is it a proprietary type design ?? | | Any information pertaining to this item or any other suggestions on BGA re-balling made easy, would be greatly appreciated. If there are any posted articles that you could direct me too, just indicate a ball-park time frame of the posting and I will search it out . | | Sincerely, | Eric R. | | ericr@nj.tanon.com | Eric: Try these guys. Dave F

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Tony Arteaga

#12918

Re: Re-Balling BGA and BGA sockets | 20 January, 1999

| | Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then processed through a reflow (oven). After reflow, the BGA is placed in water and the paper containing the balls is pulled away from the component, resulting in a reballed BGA. | | | | Is this product available on the market or is it a proprietary type design ?? | | | | Any information pertaining to this item or any other suggestions on BGA re-balling made easy, would be greatly appreciated. If there are any posted articles that you could direct me too, just indicate a ball-park time frame of the posting and I will search it out . | | | | Sincerely, | | Eric R. | | | | ericr@nj.tanon.com | | | Eric: Try these guys. Dave F | Eric, Winslow Atomation makes this preform. I have been using their preforms for BGA and Socket reballing. Winslow is the same company as Solderquik.

Thanks

Tony A

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Mark

#12919

Re: Re-Balling BGA and BGA sockets | 30 June, 1999

| Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then processed through a reflow (oven). After reflow, the BGA is placed in water and the paper containing the balls is pulled away from the component, resulting in a reballed BGA. | | Is this product available on the market or is it a proprietary type design ?? | | Any information pertaining to this item or any other suggestions on BGA re-balling made easy, would be greatly appreciated. If there are any posted articles that you could direct me too, just indicate a ball-park time frame of the posting and I will search it out . | | Sincerely, | Eric R. | | ericr@nj.tanon.com |

Eric,

There is a service available and they will do proto quantities. Check them out.

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