Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.



fluxless AuSn solder bumping for flip-chip | 30 January, 1999

Hi all, i'm researching information on fluxless solder bumping of flip-chip by either : 1. electroplating AuSn bumps 2. electroless Ni on Al pads in an autocatalysis process. could anyone point me in the direction of more information ? particularly, intermetallic diffisions, materials reactions etc.

TIA, Sidharth

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 Reflow System

Plasma prior Conformal Coating