Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Bakeing

Daniel Carlsson

#2417

Bakeing | 20 November, 2000

Does anyone have information regarding:

-Moisture level (wt%) that may cause delamination in PCB�s. -Baking time and temperature if using a Vacuum Drying Cabinett and if using an air oven. (What I�m most interested of is Poly-Imid-Aramid.) -Are there any reports or standards that deal with this matter? (Besides IPC-020 and Jesd22-A113-B.)

I�ll be greatful for any answers or descriptions how you handle the issue.

Daniel

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#2418

Re: Bakeing | 27 November, 2000

Daniel: In response to your questions: * Moisture level (wt%) that may cause delamination in PCB�s. - Certainly, it depends, but 100% moisture will not cause delamination of a PCB. [Now, heating that water is another question, isn�t it? ;-)]

* Baking time and temperature if using a Vacuum Drying Cabinet and if using an air oven. (What I�m most interested of is Poly-Imid-Aramid.) - We�ve talked about bake time and temperature before in the fine SMTnet Archives, but I believe this most often applied to FR-4, not to polyimide. - For polyimide, your fabricator can probably give you recommendations, but probably the best measure is the results of the weight loss experiments that you can perform during the baking of your boards.

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