Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Teemu M�kiniemi

#12731

PWB plating | 3 February, 1999

Hi!

Does anyone know any roadmaps for board plating materials. Especially I'm interested in finishes, which are plated onto copper.

Teemu M�kiniemi

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Chris G.

#12732

Re: PWB plating | 3 February, 1999

| Hi! | | Does anyone know any roadmaps for board plating materials. Especially I'm interested in finishes, which are plated onto copper. | | Teemu M�kiniemi |

Teemu,

For some time now, as I am sure you are aware, the PCB industry has been trying to get rid of HASL (Hot Air Solder Leveling). Having worked in PCB manufacturing, concentrating heavily on Hot Air Solder Leveling, I know the difficulties involved. Although most PCB are still solder coated in some way, orgainic solder preservatives OSPs, flat tin, paladium silver, gold over nickel over copper, silver, and other are being used more and more. Actually gold and OSPs are used often.

There is also the process where thicker levels or solder is being applied directly to the board. This means no solder paste is applied before component placement. Just flux, place, and refow.

I don't have any actual roadmaps for you but you can be assured that continued efforts will occur to perfect or eliminated HASL.

Maybe you could contact LeaRonal,Enthone-OMI,or Dexter for more information.

Good luck,

Chris G.

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Teemu M�kiniemi

#12733

Re: PWB plating | 4 February, 1999

There is also the process where thicker levels or solder is being applied directly to the board. This means no solder paste is applied before component placement. Just flux, place, and refow.

Chris G. Can you tell me more about the process, or any sources where I can found information about the process you mentioned. Do you know any reference users? The process sounds quite exotic to me.

Teemu M�kiniemi

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Chris G.

#12734

Re: PWB plating | 9 February, 1999

| There is also the process where thicker levels or solder is being applied directly to the board. This means no solder paste is applied before component placement. Just flux, place, and refow. | | Chris G. | | Can you tell me more about the process, or any sources where I can found information about the process you mentioned. Do you know any reference users? The process sounds quite exotic to me. | | | Teemu M�kiniemi | The company is called Mask Tech

407-857-1876 East Coast Office 714-557-3383 and 714-979-7500 Weat Coast Office | Thanks,

Chris

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