Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Pan Tian Shun

#12422

Wire bonding ICs to flex foil | 5 March, 1999

I need advise on how can bonding of ICs to flex foil be done. The pitch of bonding is between 70 to 100 microns and the foil thickness is from 25 to 35 microns.

Anyone, please enlighted what kind of bonding technology (thermo-sonic maybe), and currently what machine are available in the market to perform this job.

Regards.

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#12423

Re: Wire bonding ICs to flex foil | 6 March, 1999

| I need advise on how can bonding of ICs to flex foil be done. | The pitch of bonding is between 70 to 100 microns and the foil thickness is from 25 to 35 microns. | | Anyone, please enlighted what kind of bonding technology (thermo-sonic maybe), and currently what machine are available in the market to perform this job. | | Regards. | Dunno. Try this guy...

Andy Magee Flex Guru magee@donet.com

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