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SMT electronics assembly manufacturing forum.


Fine Pitch 48-pin TSOP

#2344

Fine Pitch 48-pin TSOP | 1 December, 2000

I have a proto-type PCB with a 48-Pin Fine Pitch TSOP (0.5mm pitch) with a dimension of 19mm L x 11.50mm W x 1.10 Thickness. They are at the bottomside of the PCB and I need to wave solder the board. There are 8 of them at the bottom side. Are they okay for wave soldering? Has anyone done same before. Can I request feedbacks on the process mainly on the soldering....which is wavesoldering fine pitch component. Thanks and regards, Dreamsniper

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#2345

Re: Fine Pitch 48-pin TSOP | 1 December, 2000

I have a proto-type PCB with a 48-Pin Fine Pitch TSOP (0.5mm pitch) with a dimension of 19mm L x 11.50mm W x 1.10 Thickness. They are at the bottomside of the PCB and I need to wave solder the board. There are 8 of them at the bottom side. Are they okay for wave soldering? What about adhesive application during bottomside process? Will it give us coplanarity issues after the curing process? Has anyone done same before? Can I request feedbacks on the process mainly on the post curing results as i need to glue them for bottomside process using sdhesive printing and post wave soldering results which is wavesoldering fine pitch component.

Thanks and regards, Dreamsniper [

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#2346

Re: Fine Pitch 48-pin TSOP | 1 December, 2000

I recommend paste print-reflow the bottom side then use a selective wave solder pallet to mask the SMT components on the bottom side. PeteC

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Dason C

#2347

Re: Fine Pitch 48-pin TSOP | 1 December, 2000

I agreed with PeteC to use the selective wave pallet, please aware TSSOP is classify as MSL 3. The advantage of the surface mounting allow both package body size and thickness to decrease but also increase the density of the package. Direct heating to the package combined with its ability to absorb moisture, cracking will happen. Also you need to consider the fine pitch size of the components and definitely you required to do touch up on this 8 components.

Rgds. Dason

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