Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Charlie Thornton

#11146

Component Thermal Profiles | 8 June, 1999

Can anyone please help me locate details on maximum allowable temperatures of components when passing through a reflow oven.

I think I want the thermal profile for the part, or a source or standard which will allow me to check if I can safely reflow all SMT components on a PCB, or whether some may have to be hand assembled.

Thanks in advance Charlie Thornton.

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John Thorup

#11147

Re: Component Thermal Profiles | 8 June, 1999

| Can anyone please help me locate details on maximum allowable temperatures of components when passing through a reflow oven. | | I think I want the thermal profile for the part, or a source or standard which will allow me to check if I can safely reflow all SMT components on a PCB, or whether some may have to be hand assembled. | | Thanks in advance | Charlie Thornton. | The maximum temperature for a component would be part of the manufacturers specification for the component. Generally, most all SMT components are constructed to withstand at least the temperature needed to melt the solder. (361 degrees F, 183 degrees C for 63/37 solder). Although the profile is more important to the particular solder paste you are using it would apply to the delta T or rate of change in temperature experienced by the component (heating or cooling). If you change a component's temperature too quickly it will crack, pop or be otherwise damaged. If a component has a specific restriction in this area, the manufacturer's spec sheet will show it. 2 degrees C/second is safe for most components. If in doubt, ask the manufacturer or his rep. John Thorup

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reflow oven profiler

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