Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Frank

#10965

flipchip bump metallurgy | 18 June, 1999

I would like to carry out a survey of all the available flipchip bump metallurgies available with the compatible bond pad finishes and compatible substrate attachment methods. The results will be posted on this forum. Your input will be very much appreciated. Thanks in advance.

With Kind Regards. Frank Frimpong.

reply »

SMT Replacement Nozzles

Plasma Prior to Conformal Coating