Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

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SMT electronics assembly manufacturing forum.


Larry Jeter

#10645

GSM Bump Process | 14 July, 1999

I have been recently playing the the different bump process within the Universal GSM part data software. Can anyone explain to me the differences between bump process A and E? Any feedback would be helpful

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Alain

#10646

Re: GSM Bump Process | 17 July, 1999

| I have been recently playing the the different bump process within the Universal GSM part data software. Can anyone explain to me the differences between bump process A and E? Any feedback would be helpful | Hi, first of all, these were initially implemented for further use and only process A was available. At this moment, processes B and D are still NOT used. Most of the time you will use bump process A that looks at all the balls it can find, along with the part definition and it will determine the center of the part and its rotation. Process B refers to missing ball inspect (define location where there must not be ball); and E, to all ball inspect (only deine the balls you want to inspect).

I hope this helps

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Alain

#10647

Re: GSM Bump Process | 17 July, 1999

| I have been recently playing the the different bump process within the Universal GSM part data software. Can anyone explain to me the differences between bump process A and E? Any feedback would be helpful | Hi, first of all, these were initially implemented for further use and only process A was available. At this moment, processes B and D are still NOT used. Most of the time you will use bump process A that looks at all the balls it can find, along with the part definition and it will determine the center of the part and its rotation. Process C refers to missing ball inspect (define location where there must not be ball); and E, to all ball inspect (only deine the balls you want to inspect).

I hope this helps

reply »

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