Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Bga reballing

kyung sam park

#10478

Bga reballing | 22 July, 1999

Does anyone have any experiences with bga reballing. When I had reworked failed bga part with new part It was good. So I tried to reball bga detached but failed . I guess the cause of fail is thermal shock. IS IT OK TO REBALL BGA PARTS DETACHED ? I wonder. Before an experiment I'm sured that bga parts can stand thermal shock.The result was different as I expected THE PROCESS I DID IS AS BELOW �� Detach an bga part failed with bga rework machine�� add heat �� Remove residues with solder wick ��add iron tip temp. directly on terminals of an bga part �� Flux beneath bga part (high viscosity;flux) �� Reball bga part with a tool I make�� Add heat �� Print solder pastes on pcb with a micro stencil. �� Mount bga part reballed on pcb with rework m/c attached vision system. �� soldering with Rework m/c ��add heat Including first thermal excursion, WOW 5 times thermal excursion. Is it normal to die for bga part through the 5 times thermal excursion.

I need your help and experiences

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Earl Moon

#10479

Re: Bga reballing | 22 July, 1999

| Does anyone have any experiences with bga reballing. | When I had reworked failed bga part with new part It was good. | So I tried to reball bga detached but failed . | I guess the cause of fail is thermal shock. | IS IT OK TO REBALL BGA PARTS DETACHED ? I wonder. | Before an experiment I'm sured that bga parts can stand thermal shock.The result was different as I expected | THE PROCESS I DID IS AS BELOW | �� Detach an bga part failed with bga rework machine�� add heat | �� Remove residues with solder wick ��add iron tip temp. directly on terminals of an bga part | �� Flux beneath bga part (high viscosity;flux) | �� Reball bga part with a tool I make�� Add heat | �� Print solder pastes on pcb with a micro stencil. | �� Mount bga part reballed on pcb with rework m/c attached vision system. | �� soldering with Rework m/c ��add heat | Including first thermal excursion, WOW 5 times thermal excursion. | Is it normal to die for bga part through the 5 times thermal | excursion. | | I need your help and experiences |

You did everything right according to my procedures. My only question concerns the thermal shock issue you indicate. How hot is hot and what does excess heat do to your reballed part and/or its internal connections whether during removal, reballing, or replacement/reflow?

Earl Moon

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APE South

#10480

Re: Bga reballing | 26 July, 1999

| Does anyone have any experiences with bga reballing. | When I had reworked failed bga part with new part It was good. | So I tried to reball bga detached but failed . | I guess the cause of fail is thermal shock. | IS IT OK TO REBALL BGA PARTS DETACHED ? I wonder. | Before an experiment I'm sured that bga parts can stand thermal shock.The result was different as I expected | THE PROCESS I DID IS AS BELOW | �� Detach an bga part failed with bga rework machine�� add heat | �� Remove residues with solder wick ��add iron tip temp. directly on terminals of an bga part | �� Flux beneath bga part (high viscosity;flux) | �� Reball bga part with a tool I make�� Add heat | �� Print solder pastes on pcb with a micro stencil. | �� Mount bga part reballed on pcb with rework m/c attached vision system. | �� soldering with Rework m/c ��add heat | Including first thermal excursion, WOW 5 times thermal excursion. | Is it normal to die for bga part through the 5 times thermal | excursion. | | I need your help and experiences |

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APE South

#10481

Re: Bga reballing | 26 July, 1999

Dear Mr. Park, Ahn yahn haseo and good day to you. If you are currently in Korea, APE has a direct representative there, Omni-Create in Seoul who can give you full information on BGA reball kits available. Essentially, reball kits are custom made to a technical drawing and sample component. You may just reball one ball but it depends on the skill of the person removing the defective ball as to not disturb or damage the component by exposing the die to excessive heat. Obviously, you should work the component at ONLY reflow oven temperatures. APE equipment is able to very closely approximate these conditions through our patented technology of high energy and low temperature. Something no one else is able to do. All of our reball kits are custom made and will work very well with our rework equipment. If you need more information, please feel free to call us at 305-451-4722 here in the US or, if you are in Korea, please feel free to call our representative company, Omni-Create in Seoul at: (82) 25-622-911. Or, contact our web site at www.apecorp.com for complete discussion and assistance on your particular problem. Thank you for your time and we look forward to being of assistance to you. Jack Reed, APE South, Key Largo, Florida USA Asian Sales Manager

| Does anyone have any experiences with bga reballing. | When I had reworked failed bga part with new part It was good. | So I tried to reball bga detached but failed . | I guess the cause of fail is thermal shock. | IS IT OK TO REBALL BGA PARTS DETACHED ? I wonder. | Before an experiment I'm sured that bga parts can stand thermal shock.The result was different as I expected | THE PROCESS I DID IS AS BELOW | �� Detach an bga part failed with bga rework machine�� add heat | �� Remove residues with solder wick ��add iron tip temp. directly on terminals of an bga part | �� Flux beneath bga part (high viscosity;flux) | �� Reball bga part with a tool I make�� Add heat | �� Print solder pastes on pcb with a micro stencil. | �� Mount bga part reballed on pcb with rework m/c attached vision system. | �� soldering with Rework m/c ��add heat | Including first thermal excursion, WOW 5 times thermal excursion. | Is it normal to die for bga part through the 5 times thermal | excursion. | | I need your help and experiences |

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