Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


BGA PAD REDUCTION

#10337

BGA PAD REDUCTION | 30 July, 1999

Has anyone done the research on BGA pad size? suppose I have a 0.030" diameter pad as recommended pad size from the spec, what will the minimum pad size allowed? We are laying out a high density board.

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Miguel Mariscal

#10338

Re: BGA PAD REDUCTION | 31 July, 1999

| Has anyone done the research on BGA pad size? suppose I have a 0.030" diameter pad as recommended pad size from the spec, what will the minimum pad size allowed? We are laying out a high density board. |

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Miguel Mariscal

#10339

Re: BGA PAD REDUCTION | 31 July, 1999

| Has anyone done the research on BGA pad size? suppose I have a 0.030" diameter pad as recommended pad size from the spec, what will the minimum pad size allowed? We are laying out a high density board. | If you know what component your'e going to use check the recomended land pattern lay out also check the IPC guidlines it may state the minimum pad reqiurements.

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Jim Blankenhorn

#10340

Re: BGA PAD REDUCTION | 2 August, 1999

| | Has anyone done the research on BGA pad size? suppose I have a 0.030" diameter pad as recommended pad size from the spec, what will the minimum pad size allowed? We are laying out a high density board. | | If you know what component your'e going to use check the recomended land pattern lay out also check the IPC guidlines it may state the minimum pad reqiurements. | Dior- The pad size used for a BGA depends upon 1) the ball pitch and 2) the type of ball used. If you using a plastic package, they use eutectic solder and for a .050" pitch the pad is nominally .025". If the package is a tape ball grid array then you are into larger lands for a .050" pitch, usually .032" for a 6 mil stencil.

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