Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Earl Moon

#10105

Air-Vac stuff | 17 August, 1999

I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the advertising stuff true?

Model SRM4 Desoldering And Resoldering Equipment

The SRM4 is designed for desoldering and resoldering of multi-lead through hole components. The solder reflow process yields measurable benefits when compared to traditional hand tool methods including:

1) Less Time Required Heat is transmitted to all joints simultaneously. Any component, regardless of the number of leads, can be removed or soldered in approximately five seconds.

2) Lower Temperature The high thermal capacity of molten solder allows a lower operating temperature than vacuum, hot air, or conductive desoldering tool; 500�F for solder reflow versus 600�F - 750�F for hand tools.

3) Safer Since only molten solder contacts the joint, the risk of pad delamination caused by mechanical stress from tip contact is eliminated. Lower temperature for less time results in significantly less heat exposure to both components and PCB's.

4) Better Quality Setting proper temperature, time and solder flow rate insures quality solder joints. The application of molten solder improves the formation of top side fillets. Operator dependency is virtually eliminated. A simple, controlled operation consists of:

� Removal: Any specific multi-lead component can be accurately located over a wave of molten solder whose shape matches the lead pattern of the component. A pre-determined volume of solder flows for approximately five seconds against the bottom of the board transmitting heat simultaneously to all component leads and when all joints are molten, the component is lifted from the board.

� Cleaning the Holes: After component removal, an air cleaning hood is lowered against the board surface. Low pressure air is applied to the lead pattern, forcing the molten solder from all holes.

� Resoldering: Replacement component is inserted and fluxed. Then molten solder is flowed against the entire lead pattern.

For big Dave F, I got my K-Mart special pancake griddle (model 76212) with a patented non stick surface to cook me up a batch of 10"x16" boards. This thing may work.

Earl Moon

reply »

#10106

Re: Air-Vac stuff | 19 August, 1999

| I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the advertising stuff true? | | Model SRM4 Desoldering And Resoldering Equipment | | The SRM4 is designed for desoldering and resoldering of multi-lead through hole components. The solder reflow process yields measurable benefits when compared to traditional hand tool methods including: | | 1) Less Time Required | Heat is transmitted to all joints simultaneously. Any component, regardless of the number of leads, can be removed or soldered in approximately five seconds. | | 2) Lower Temperature | The high thermal capacity of molten solder allows a lower operating temperature than vacuum, hot air, or conductive desoldering tool; 500�F for solder reflow versus 600�F - 750�F for hand tools. | | 3) Safer | Since only molten solder contacts the joint, the risk of pad delamination caused by mechanical stress from tip contact is eliminated. Lower temperature for less time results in significantly less heat exposure to both components and PCB's. | | 4) Better Quality | Setting proper temperature, time and solder flow rate insures quality solder joints. The application of molten solder improves the formation of top side fillets. Operator dependency is virtually eliminated. A simple, controlled operation consists of: | | � Removal: | Any specific multi-lead component can be accurately located over a wave of molten solder whose shape matches the lead pattern of the component. A pre-determined volume of solder flows for approximately five seconds against the bottom of the board transmitting heat simultaneously to all component leads and when all joints are molten, the component is lifted from the board. | | � Cleaning the Holes: | After component removal, an air cleaning hood is lowered against the board surface. Low pressure air is applied to the lead pattern, forcing the molten solder from all holes. | | � Resoldering: | Replacement component is inserted and fluxed. Then molten solder is flowed against the entire lead pattern. | | For big Dave F, I got my K-Mart special pancake griddle (model 76212) with a patented non stick surface to cook me up a batch of 10"x16" boards. This thing may work. | | Earl Moon | Earl,

Although I'm not familiar with the Air-Vac version of this solder fountain system, we have 4 Electrovert SoldaPac solder reflow systems, a similar machine.

If the Air-Vac is similar to the Electrovert, you should be able to use it for most any multilayer component rework or hole clearing job.

You can't underestimate operator skill and experience. Using these "volcanos" is dangerous to both operator and PCB.

Jeff Ferry

reply »

Earl Moon

#10107

Re: Air-Vac stuff | 19 August, 1999

| | I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the advertising stuff true? | | | | Model SRM4 Desoldering And Resoldering Equipment | | | | The SRM4 is designed for desoldering and resoldering of multi-lead through hole components. The solder reflow process yields measurable benefits when compared to traditional hand tool methods including: | | | | 1) Less Time Required | | Heat is transmitted to all joints simultaneously. Any component, regardless of the number of leads, can be removed or soldered in approximately five seconds. | | | | 2) Lower Temperature | | The high thermal capacity of molten solder allows a lower operating temperature than vacuum, hot air, or conductive desoldering tool; 500�F for solder reflow versus 600�F - 750�F for hand tools. | | | | 3) Safer | | Since only molten solder contacts the joint, the risk of pad delamination caused by mechanical stress from tip contact is eliminated. Lower temperature for less time results in significantly less heat exposure to both components and PCB's. | | | | 4) Better Quality | | Setting proper temperature, time and solder flow rate insures quality solder joints. The application of molten solder improves the formation of top side fillets. Operator dependency is virtually eliminated. A simple, controlled operation consists of: | | | | � Removal: | | Any specific multi-lead component can be accurately located over a wave of molten solder whose shape matches the lead pattern of the component. A pre-determined volume of solder flows for approximately five seconds against the bottom of the board transmitting heat simultaneously to all component leads and when all joints are molten, the component is lifted from the board. | | | | � Cleaning the Holes: | | After component removal, an air cleaning hood is lowered against the board surface. Low pressure air is applied to the lead pattern, forcing the molten solder from all holes. | | | | � Resoldering: | | Replacement component is inserted and fluxed. Then molten solder is flowed against the entire lead pattern. | | | | For big Dave F, I got my K-Mart special pancake griddle (model 76212) with a patented non stick surface to cook me up a batch of 10"x16" boards. This thing may work. | | | | Earl Moon | | | Earl, | | Although I'm not familiar with the Air-Vac version of this solder fountain system, we have 4 Electrovert SoldaPac solder reflow systems, a similar machine. | | If the Air-Vac is similar to the Electrovert, you should be able to use it for most any multilayer component rework or hole clearing job. | | You can't underestimate operator skill and experience. Using these "volcanos" is dangerous to both operator and PCB. | | Jeff Ferry | Jeff,

Appreciate the info. The reason I have nearly one good eye, don't put my picture in my DFM/CE column, can barely walk, and have trouble typing is because of one of these "volcanos" or was all this caused in some horrible crash with a fast moving soldering iron tip?

Hell, I just develop the process, with help from you all, and train the operators. They get all the hero medals, and little else they deserve - like great pay. Anyway, I still have to find the way to clean solder out of little holes in very thick MLB's.

Thanks,

Earl Moon

reply »

Don Morgenstern

#10108

Re: Air-Vac stuff | 20 August, 1999

Earl & Jeff Our machine is different than the Electrovert Solder Pak in that it is does not behave like a "volcano". Jeff, please contact me if you have safety concerns as perhaps you also want to consider our equipment.

| | I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the advertising stuff true? | | | | Model SRM4 Desoldering And Resoldering Equipment | | | | The SRM4 is designed for desoldering and resoldering of multi-lead through hole components. The solder reflow process yields measurable benefits when compared to traditional hand tool methods including: | | | | 1) Less Time Required | | Heat is transmitted to all joints simultaneously. Any component, regardless of the number of leads, can be removed or soldered in approximately five seconds. | | | | 2) Lower Temperature | | The high thermal capacity of molten solder allows a lower operating temperature than vacuum, hot air, or conductive desoldering tool; 500�F for solder reflow versus 600�F - 750�F for hand tools. | | | | 3) Safer | | Since only molten solder contacts the joint, the risk of pad delamination caused by mechanical stress from tip contact is eliminated. Lower temperature for less time results in significantly less heat exposure to both components and PCB's. | | | | 4) Better Quality | | Setting proper temperature, time and solder flow rate insures quality solder joints. The application of molten solder improves the formation of top side fillets. Operator dependency is virtually eliminated. A simple, controlled operation consists of: | | | | � Removal: | | Any specific multi-lead component can be accurately located over a wave of molten solder whose shape matches the lead pattern of the component. A pre-determined volume of solder flows for approximately five seconds against the bottom of the board transmitting heat simultaneously to all component leads and when all joints are molten, the component is lifted from the board. | | | | � Cleaning the Holes: | | After component removal, an air cleaning hood is lowered against the board surface. Low pressure air is applied to the lead pattern, forcing the molten solder from all holes. | | | | � Resoldering: | | Replacement component is inserted and fluxed. Then molten solder is flowed against the entire lead pattern. | | | | For big Dave F, I got my K-Mart special pancake griddle (model 76212) with a patented non stick surface to cook me up a batch of 10"x16" boards. This thing may work. | | | | Earl Moon | | | Earl, | | Although I'm not familiar with the Air-Vac version of this solder fountain system, we have 4 Electrovert SoldaPac solder reflow systems, a similar machine. | | If the Air-Vac is similar to the Electrovert, you should be able to use it for most any multilayer component rework or hole clearing job. | | You can't underestimate operator skill and experience. Using these "volcanos" is dangerous to both operator and PCB. | | Jeff Ferry |

reply »

ScottM

#10109

Re: Air-Vac stuff | 20 August, 1999

| I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the advertising stuff true? | | Model SRM4 Desoldering And Resoldering Equipment | | The SRM4 is designed for desoldering and resoldering of multi-lead through hole components. The solder reflow process yields measurable benefits when compared to traditional hand tool methods including: | | 1) Less Time Required | Heat is transmitted to all joints simultaneously. Any component, regardless of the number of leads, can be removed or soldered in approximately five seconds. | | 2) Lower Temperature | The high thermal capacity of molten solder allows a lower operating temperature than vacuum, hot air, or conductive desoldering tool; 500�F for solder reflow versus 600�F - 750�F for hand tools. | | 3) Safer | Since only molten solder contacts the joint, the risk of pad delamination caused by mechanical stress from tip contact is eliminated. Lower temperature for less time results in significantly less heat exposure to both components and PCB's. | | 4) Better Quality | Setting proper temperature, time and solder flow rate insures quality solder joints. The application of molten solder improves the formation of top side fillets. Operator dependency is virtually eliminated. A simple, controlled operation consists of: | | � Removal: | Any specific multi-lead component can be accurately located over a wave of molten solder whose shape matches the lead pattern of the component. A pre-determined volume of solder flows for approximately five seconds against the bottom of the board transmitting heat simultaneously to all component leads and when all joints are molten, the component is lifted from the board. | | � Cleaning the Holes: | After component removal, an air cleaning hood is lowered against the board surface. Low pressure air is applied to the lead pattern, forcing the molten solder from all holes. | | � Resoldering: | Replacement component is inserted and fluxed. Then molten solder is flowed against the entire lead pattern. | | For big Dave F, I got my K-Mart special pancake griddle (model 76212) with a patented non stick surface to cook me up a batch of 10"x16" boards. This thing may work. | | Earl Moon | I've got a SBRM12 that I do all sorts of creative things with "it cuts, it chops, it dices...". But I've yet to try and remove connectors from a 20 layer board, 14 yes - not 20. I've pulled connectors off backplanes easily. No, it's not a "volcano" but a very tame and robust system - not as pretty as some of their competitors (it's bulky) but once you see it in operation - oooh... pant...

And, Air Vac will demo it for you. Contact your local rep and have them come by, give them your spec to see if they have the right stuff... Have them remove one for you as proof.

Good luck, Scott

reply »

Earl Moon

#10110

Re: Air-Vac stuff | 20 August, 1999

| | I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the advertising stuff true? | | | | Model SRM4 Desoldering And Resoldering Equipment | | | | The SRM4 is designed for desoldering and resoldering of multi-lead through hole components. The solder reflow process yields measurable benefits when compared to traditional hand tool methods including: | | | | 1) Less Time Required | | Heat is transmitted to all joints simultaneously. Any component, regardless of the number of leads, can be removed or soldered in approximately five seconds. | | | | 2) Lower Temperature | | The high thermal capacity of molten solder allows a lower operating temperature than vacuum, hot air, or conductive desoldering tool; 500�F for solder reflow versus 600�F - 750�F for hand tools. | | | | 3) Safer | | Since only molten solder contacts the joint, the risk of pad delamination caused by mechanical stress from tip contact is eliminated. Lower temperature for less time results in significantly less heat exposure to both components and PCB's. | | | | 4) Better Quality | | Setting proper temperature, time and solder flow rate insures quality solder joints. The application of molten solder improves the formation of top side fillets. Operator dependency is virtually eliminated. A simple, controlled operation consists of: | | | | � Removal: | | Any specific multi-lead component can be accurately located over a wave of molten solder whose shape matches the lead pattern of the component. A pre-determined volume of solder flows for approximately five seconds against the bottom of the board transmitting heat simultaneously to all component leads and when all joints are molten, the component is lifted from the board. | | | | � Cleaning the Holes: | | After component removal, an air cleaning hood is lowered against the board surface. Low pressure air is applied to the lead pattern, forcing the molten solder from all holes. | | | | � Resoldering: | | Replacement component is inserted and fluxed. Then molten solder is flowed against the entire lead pattern. | | | | For big Dave F, I got my K-Mart special pancake griddle (model 76212) with a patented non stick surface to cook me up a batch of 10"x16" boards. This thing may work. | | | | Earl Moon | | | I've got a SBRM12 that I do all sorts of creative things with "it cuts, it chops, it dices...". But I've yet to try and remove connectors from a 20 layer board, 14 yes - not 20. I've pulled connectors off backplanes easily. No, it's not a "volcano" but a very tame and robust system - not as pretty as some of their competitors (it's bulky) but once you see it in operation - oooh... pant... | | And, Air Vac will demo it for you. Contact your local rep and have them come by, give them your spec to see if they have the right stuff... Have them remove one for you as proof. | | Good luck, | Scott | Scott,

Good to see from you. As we speak, I am admiring my demo SRM4 unit right beside me in the cubicle. Wish I could fire it up here, but the Safety Lady sits right next to me and she said not way. Besides, I ain't got no 220 or air up here.

I'm almost sure this machine won't do exactly what's needed, but combined with other factors, it might get close. If it gets close, I'll try the super big one of which you speak. I'll know more Monday.

Earl Moon

reply »

Reflow Oven

 Reflow System