Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


K. Vikas Sharma

#10011

Help for CSP Prototyping | 21 August, 1999

Want to know the Tools/ Process required to get started with CSP prototyping and R & D. Anyone working on this , please help out.

reply »

Earl Moon

#10012

Re: Help for CSP Prototyping | 21 August, 1999

| Want to know the Tools/ Process required to get started with CSP prototyping and R & D. | Anyone working on this , please help out. | Depending on the type, size, and pitch - just like BGA's, they aren't tough. Our 1mm types went through prototyping without notice by operators or inspection personnel. Our .8mm required some extra printing care, as inspection (using 3D equipment), almost 1:1 apertures, right-on alignment, and a slightly modified reflow profile to continue using our current paste (SMQ-92J).

Just as BGA's, we X-Ray 100% prototypes and refine processes from there. Reworking 1mm wasn't too bad, but .8's pushed the micro-stencil solder paste application process so we're working on that to improve yields.

Just a note: I'm using the definition of CSP as being a "BGA" package not exceeding 20% of the chip size it encases.

Earl Moon

reply »

K. Vikas Sharma

#10013

Re: Help for CSP Prototyping | 21 August, 1999

| | Want to know the Tools/ Process required to get started with CSP prototyping and R & D. | | Anyone working on this , please help out. | | | Depending on the type, size, and pitch - just like BGA's, they aren't tough. Our 1mm types went through prototyping without notice by operators or inspection personnel. Our .8mm required some extra printing care, as inspection (using 3D equipment), almost 1:1 apertures, right-on alignment, and a slightly modified reflow profile to continue using our current paste (SMQ-92J). | | Just as BGA's, we X-Ray 100% prototypes and refine processes from there. Reworking 1mm wasn't too bad, but .8's pushed the micro-stencil solder paste application process so we're working on that to improve yields. | | Just a note: I'm using the definition of CSP as being a "BGA" package not exceeding 20% of the chip size it encases. | | Earl Moon | Thanks Mr.Earl. Information given by you is useful.Can you plese suggest equipments to be used for this we are in prototying stage only.

reply »

Earl Moon

#10014

Re: Help for CSP Prototyping | 22 August, 1999

| | | Want to know the Tools/ Process required to get started with CSP prototyping and R & D. | | | Anyone working on this , please help out. | | | | | Depending on the type, size, and pitch - just like BGA's, they aren't tough. Our 1mm types went through prototyping without notice by operators or inspection personnel. Our .8mm required some extra printing care, as inspection (using 3D equipment), almost 1:1 apertures, right-on alignment, and a slightly modified reflow profile to continue using our current paste (SMQ-92J). | | | | Just as BGA's, we X-Ray 100% prototypes and refine processes from there. Reworking 1mm wasn't too bad, but .8's pushed the micro-stencil solder paste application process so we're working on that to improve yields. | | | | Just a note: I'm using the definition of CSP as being a "BGA" package not exceeding 20% of the chip size it encases. | | | | Earl Moon | | | Thanks Mr.Earl. | Information given by you is useful.Can you plese suggest equipments to be used for this we are in prototying stage only. | | For any application, you need a very good automatic stencil printer, foils, pastes, P/P, reflow, X-Ray, and all the rest. I guess the question is: What do you have now and where do you want to go in terms of volume, product, etc.?

Earl Moon

reply »

Software for SMT

Reflow Ovens thermal process improvement