Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

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Chris May

#9236

Process Trial Records | 30 September, 1999

Guys & Gals,

I am at present instigating a formal method of recording and tracking any "process" trials that we may wish to run, such as a new paste, different packaged device etc;

I started with a simple form.....too simple, but now I think I've probably gone over the top. We all know how people hate filling in forms at the best of times.

Has any one been down this road and got a "to-the-point" form, (that is one without QA involvement), that they could attach to an e-mail, preferably in Office '97 Word format ??

Thanks for taking time...

Chris

p.s. Why is there only one monopolies commission ???

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#9237

Re: Process Trial Records | 30 September, 1999

| Guys & Gals, | | I am at present instigating a formal method of recording and tracking any "process" trials that we may wish to run, such as a new paste, different packaged device etc; | | I started with a simple form.....too simple, but now I think I've probably gone over the top. We all know how people hate filling in forms at the best of times. | | Has any one been down this road and got a "to-the-point" form, (that is one without QA involvement), that they could attach to an e-mail, preferably in Office '97 Word format ?? | | Thanks for taking time... | | Chris | | p.s. Why is there only one monopolies commission ??? | Damn Instigators!!!!

I struggle to see how you could record and track process trials on a common form for both a process material (paste) and a packaged device, unless the form was very heavy and had separate sections for each process material and the packaged device.

In evaluating paste, we test:

1. Solder ball 2. No-clean residue / post wash cleanliness 3. Solder wetting 4. Slump 5. Tack 6. Work life

Further, you�d need sections to your form for assessing the effect of process material change on wave soldering, cleaning, hand work, etc. You couldn�t use the same tests for a peelable solder mask as a solder paste, could you?

Process trials of an alternate package form require that you consider the concerns of different process areas, including:

1. Stockroom: Storage and handling concerns (ie, shelving location, shelf life, moisture sensitivity) 2. Kitting: Handling, forming, spoilage 3. Placement/assembly: Feeding, vision, component height, spoilage 4. Soldering: Solder wetting 5. Cleaning: Package cleanliness, under package cleanliness 6. Ship handling: Ship packing, ESD bag

May be I misinterpret you, but your not wanting to involve QA in evaluating process change is a bit concerning. Aren�t you working at cross purposes by wanting to change process and not wanting to involve the people whose job it is to control process?

When we consider process change, we first evaluate the impact of the change. Changes with the broadest impact require notification of everyone from the operator to the customer. Changes with small impact require notification of the process operator. Change impact / notification requirements are defined up-front.

Ps: Damn straight, what�s a monopolies commission ???

Ta

Dave F

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