I am a new employee at a company that has had a large turnover of employees over the past year. I am working on a board (components on one side only), the engineer wants to use an .035 pad with a .012 dia. hole, there are no via's under the zero clearance components. But manufacturing wants to use an .035 pad with a .012 dia. hole because the solder is wicking up so high the assembler is saying there's a problem (with the non-zero clearence components), is the problem with the solder bath level? and if so isn't this level easy to change?