When I evaluated a new glue type, I simply used a shear force tester (Chatillon) to compare the cured strengths of the different glues. I sampled parts of different types; 0805, SOT23, 1206, and various tantalum caps. I analyzed the data based on each different type of component. Most (if not all) of the SMT adhesives do not like curing at 230. I used to have significant problems with missing components that we traced back to improper curing. Curing at too high a temp caused the glue to blow the parts off the board. Most of the adhesives cure in less than 2 minutes at 150 C.