We are a mid sized PCB manufacturer experiencing some defects in our plating process, which is causing microscopic bumps (visual - naked eye after electroplating) on the copper clad surface, which is random in nature. The process flow (characterized) is as follows -------Clean (water/hot air) ->chem. Clean ->Electroless Cu ->Clean (hot air)->Electroplating->Inspection. We have checked chemicals, possible contamination and plating current requirements for that specific program�. Everything seems all right. Appreciate if someone could give me a second opinion for this defect.