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Component Drop on Second side of the reflow

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#78677

Component Drop on Second side of the reflow | 12 August, 2017

We are facing component Drop on second side of the reflow.We are using Senju Reflow oven..Profile judgement was within in the standard.All the component Drop occur in between last heating zone and cooling Zone.The dropped component is ICC 525FL5 SOP and ACT45C-510 Filter..What are check points I need to check..In last month we produced 4000 products out of these 24 component Drop occured..I want to know about component Drop mechanism.

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#78679

Component Drop on Second side of the reflow | 13 August, 2017

my guess is these components are with small pads and with not enough solder to hold them

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#78680

Component Drop on Second side of the reflow | 13 August, 2017

These two components are tallest among other components.Is there any method to check pad size required according to component leads?

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#78685

Component Drop on Second side of the reflow | 14 August, 2017

The pads in the datasheet should suffice. The TDK part really isn't all that big but its reflow profile indicates it is not exactly the most tolerant device with regards to heat. 245C for 5s is not a lot, I would check very carefully that your profile is keeping under those limits particularly on the underside, after all that device doesn't need to reflow on its 2nd pass anyway.

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#78687

Component Drop on Second side of the reflow | 14 August, 2017

We check the TDK data sheet reflow profile condition. We check the PCB surface temperature the max temperature is 237.Anyhow We will confirm it by check temperature on TDK point

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#78692

Component Drop on Second side of the reflow | 14 August, 2017

Glue it!

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