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SMT chip component drop after DIP

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#76438

SMT chip component drop after DIP | 9 October, 2016

Hello everybody Good day My company is facing big problem with Chip drop after dipping I have analysis many case focus on 02 main cause 1. Handling process -> I would like to ask after glue bonding is abalibity drop. I test by force equipment that it is very difficult to drop after reflow 2. Very due by DIP machine. I check after Dip many chip drop. I wonder the glue not qualify I am using IR 130. Could you help me how to check the quality of glue IR 130 And the reflow profile how is suitable for it Thanks and best regards

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#76447

SMT chip component drop after DIP | 11 October, 2016

On Measuring glue strength: Here's what our friend Bob Willis [what seems a short while ago] said ... http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=17031

Further, there's lots of blab in the SMTnet archives on glue testing, torque, shear, push, testing tools, different glues etc No shortage of opinions here.

On your process flow: Last time [what was a long time ago] I did the the process that you're describing, it went: Top side SMT=> Reflow => Top side DIP => Bottom side glue => Bottom side SMT => Wave solder ... We couldn't keep the DIP clinch apparatus away from the bottom side SMT if we did the bottom side SMT prior to DIP.

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reflow oven profiler

Non-heated dispensing system