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Melted BGA part

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#76347

Melted BGA part | 15 September, 2016

While removing one part, another part - BGA part - several components away, actually melted on one corner - you can see the plastic body of the part oozing out around one corner between the solder balls. Several of the solder balls on the one corner bridged together also. This was a part closer to the edge of the CCA (there was a smaller part closer to the edge) and the melting old occurred on the one corner. I am worried about removing this part. Will the plastic adhere to the pads and cause lifted pads or other damage? Leaded part to the temp never reached above 250 deg C.

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#76350

Melted BGA part | 15 September, 2016

Remove,clean, re-ball(or use new part), reflow. Body of the part is designed to withstand heat that is higher than the melting point of the balls alloy.

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#76357

Melted BGA part | 15 September, 2016

In electronic manufacture, it's never good when "oozing" is part of the conversation.

"Bridging" that's bad too.

"Melting" sometimes good, sometimes bad.

Got pix? How about some nice color pictures?

Attachments:

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#76374

Melted BGA part | 20 September, 2016

Have you encountered this? There is black plastic from underneath the chip - oozing out between some of the solder. Like the part melted from underneath. It wasn't even under the chimney and had no direct heat on it. I am afraid if I try to remove it, more of the part will melt... will this cause damage to the pads? Any advice?

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#76375

Melted BGA part | 20 September, 2016

I do have a couple pictures, but they aren't very clear and I am not sure how to post them on this site yet.

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#76376

Melted BGA part | 20 September, 2016

Attaching a picture ...

In a thread that you posted: EDIT => ATTACHMENTS => CHOOSE FILE =>[select a save file / OPEN] => ADD => OK=> POST

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