Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


MSL Level 1 Component Question

Views: 1240

#75712

MSL Level 1 Component Question | 12 May, 2016

If an electronic component with a MSL rating of 1 is exposed to an moist environment greater than the 85% relative humidity to the point where the packaging is wet, what is the risk level of using the device in a lead-free soldering reflow process? Also if it does need to be baked out (dried) what process/times should be used?

reply »

#75713

MSL Level 1 Component Question | 12 May, 2016

Hi

Are we talking about a BGA or a resistor. Knowing the type of part would help.

reply »

#75714

MSL Level 1 Component Question | 12 May, 2016

We are talking about an IC in a TO263 package.

reply »

#75716

MSL Level 1 Component Question | 12 May, 2016

This is just me but I would just let it air dry. If you think about it. If you were using water soluble paste you would run it through a washer and it would survive. If this was a BGA i would be very concerned. If you are truly worried look an the manufacture site about any baking recommendations.

reply »

#75723

MSL Level 1 Component Question | 13 May, 2016

Depends a little on how long it was exposed to the wet environment as moisture absorption by electrical components is a very slow process. That said, MSL 1 rated components can be exposed to high humidity indefinitely and still not need to be baked. I think your risk level for component failure is very low.

reply »

Reflow Ovens thermal process improvement

table top X-ray inspection