Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.

Solderability test - OSP

Views: 3988


Solderability test - OSP | 11 February, 2016

What is the most appropriate method to solderability test in OSP surface finish PCB? I have used Edge Dip for Surface Features testing, but the results are failed in some features. I haven't also found standards to OSP surface finish. Thank you for now.

reply »


Solderability test - OSP | 11 February, 2016


* J-STD-003 “Solderability Tests for Printed Boards”

* IPC-4555 OSP Finish Specification

reply »


Solderability test - OSP | 12 February, 2016

IPC-4555 has not completed yet. According to IPC org, it will be complete in mid-2017. Is there another guideline about OSP finish surface? In fact, we assembled 50 pieces and no problem. But in solderability test we have problems in some features. Does someone has advice about this issue? Thank you

reply »


Solderability test - OSP | 16 February, 2016

George Milad is the Head of the IPC IPC Plating Committee 4‐14. The IPC Plating Committee 4‐14 is developing the IPC-4555 OSP Finish Specification. He can give the best advice. Contact George [George Milad, National Accounts Manager for Technology, Uyemura International Corporation, 240 Town Line Rd Southington, CT 06489;]

reply »


Solderability test - OSP | 17 February, 2016

Thank you very much to your reply. I have just sent an email to George Milad, according to your advice.

reply »

Reflow Oven

Metcal soldering rework