Greetings! I have a problem with PAD connection in inner layers of 4 layer PCB (signal1, GND, POWER, signal2). Sometimes there is no connection between pad and power plane. I'm using termal relief around PAD in inner layers (same shape pad trough whole board), is it possible that this is the problem?
So my question is, what are the advantages and disadvantages of using a relief connection in inner layers? If someone had the same problem please give me the advice.