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Regarding the Footprint designing for Wire bonding technology based Microntroller

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Regarding the Footprint designing for Wire bonding technology based Microntroller | 29 May, 2015

Hiee everyone,

I am a Hardware Engineer and also a PCB designer.

I am using a Microntroller which is in "CHIP PACKAGE".

So in order to connect our microcontroller with my PCB, i am using "Wire bonding Technology".

So, Can any one suggust

1. which type of wire bonding should i use among

- Ball Bonding

- Wedge Bonding

- Compliant Bonding ?

SPECIFICATIONS:

I. Size of Microntroller - 3.6mm X 3.6mm

II. Thickness Of Microcontroller - 200um

III. Low Power Application

2. How to design foot print for PCB designing according to choosen wire bonding technology ?

Can any suggust a better Websites or Pdf Link's etc.. about wirebonding.

Regards,

Anirudh THABJUL

Lansa Diffusion, Paris, France

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