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I am a Hardware Engineer and also a PCB de...
- May 29, 2015
Regarding the Footprint designing for Wire bonding technology based Microntroller | 29 May, 2015
I am a Hardware Engineer and also a PCB designer.
I am using a Microntroller which is in "CHIP PACKAGE".
So in order to connect our microcontroller with my PCB, i am using "Wire bonding Technology".
So, Can any one suggust
1. which type of wire bonding should i use among
- Ball Bonding
- Wedge Bonding
- Compliant Bonding ?
I. Size of Microntroller - 3.6mm X 3.6mm
II. Thickness Of Microcontroller - 200um
III. Low Power Application
2. How to design foot print for PCB designing according to choosen wire bonding technology ?
Can any suggust a better Websites or Pdf Link's etc.. about wirebonding.
Lansa Diffusion, Paris, France
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