Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Agilent 5DX

andyc

#7455

Agilent 5DX | 30 July, 2001

Hi - I'm looking at 5DX as a method for inspecting BGA joints and would like to hear from anyone with knowledge of this system . Can you tell me how reliable you have found it to be in catching BGA opens ? ...... also any other comments you may have on programming ease , reliability , false calls versus genuine call rates etc. . Thanks .

reply »

#7485

Agilent 5DX | 30 July, 2001

The 5DX weighs 8000 pounds. Can your product bear the overhead? We use acoustic microscopy to find BGA opens. We have not had good luck finding opens with other inspection technology.

Has Agilent told you that you can detect BGA opens? How is that? By tilting the "table"?

reply »

andyc

#7494

Agilent 5DX | 31 July, 2001

Thanks for the input Dave ... acoustic microsscopy sounds interesting - can you give me any leads on companies or info I can look up ? .

reply »

#7508

Agilent 5DX | 31 July, 2001

SUPPLIERS: * Sonix 8700 Morrissette Dr Springfield, VA 22152 (703) 440-0222 ext 155 fax 9512 John Goings * Sonoscan 2149 E Pratt Blvd Elk Grove Village IL 60007 800.950.2638 630.766.7088 fax 4603 http://www.sonoscan.com info @sonoscan.com John Ippen (sales x247) Ray Thomas (contract x245)

SERVICE PROVIDERS: Don�t forget that suppliers offer service work.

MORE: * An article in �Journal Of Surface Mount Technology� that had some coo SAM [surface acoustic microscopy] pix of BGA ball cracking, but I cannot find it. I believe the article was on �black pad�. Try a search of the �knowledge base� at SMTA [http://www.smta.org]. * �Electronic Failure Analysis Handbook� Martin, PL, McGraw-Hill has a chapter on using acoustic imaging to analyze failures in electronic packages. * Google [http://www.google.com] tosses-up almost 15,000 hits on �acoustic microscopy�.

FINAL NOTE: Like the 5DX, SAM is not an in-process inspection tool. It will confirm cracked BGA balls or package cracks. [They glow white, coo!!!] Shortly there after, you'll need to be pouring epoxy and lighting-up the saws and grinders to see / understand what's happening. While I don't expect you to be running-out to purchase one of these pups, you time might be better spent doing a quick analysis, some sections [probably, you could just pop that dude off with a screw driver] and then diving into fighting the cause of the problem.

What kind of solderability protection is on your board? What's on the BGA interposer?

reply »

#7514

Agilent 5DX | 31 July, 2001

Just so that you know, the 5DX does laminography. Like the word lamination, laminography takes a series of short focal length xrays, each a little deeper than the previous. Microlaminography allows layer by layer information to be measured in 'slices' as small as 10 microns. Questionable solder joints, disbonds and voids are easily detected. This imaging allows visualization of the internal details of thin multilayer structures such as ball grid arrays and printed circuit boards. It is quite costly (ie, machine cost, inspection time, programming, results interpretation, etc) as a routine inspection tool. For more, look here: http://lca.kaist.ac.kr/Research/2000/X_lamino.html

Yano, I want to say Caldon W. Driscoll ACI USA 610-362-1200 cdriscoll@aciusa.org has a laminography machine, probably a 5DX. Give him a call, just to check. I think he'll be glad to talk with you, he seems very lonely.

reply »

Real-time PCB X-ray Inspection System

Fluid Dispense Pump Integration