I am looking at the Pump application for several bottom side applications we have. They are heavy in through hole radial and dip content. The initial testing of the stencil was very good, but I am concerned with inspection of the glue. We do a sampling basis now with all Fuji GL and UIC GDM dispense lines. This is not a good method due to the fact that we might have 30 units build before detection occurs (scrap in most cases). Does anyone have any knowledge of containment for wet epoxy (with cost being a factor)?