We have a board that has an RF shield on one side and ceramic capacitors on the other side. The side with the capacitors is reflowed first, then the other side is reflowed. We have been experiencing cracked capacitors in these boards. My guess is that somehow the RF shield is contracting at a different rate than the FR4 board as it cools, causing the capacitors to crack. I was wondering if anyone has had an experience like that and if there is anything we can do to mitigate this problem. Thanks.