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selective solder process attributes

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#73041

selective solder process attributes | 10 November, 2014

We have the opportunity to buy a new selective solder machine and are used to using a very old Jade machine with a moving tank and wetted nozzle. I have two process concept questions: Which is better- move the board over the nozzle or move the nozzle under the board?

Is a non-wetted nozzle easier to use than a wetted nozzle?

Thanks

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#73042

selective solder process attributes | 10 November, 2014

I can't claim to be an expert....I've just bought a used RPS, and it'll be my first...but, after reading through their manual, and working on setting things up, I'd say:

-Conceptually, I like the idea of moving the board rather than moving the entire pot. That's a lot of weight to move in precision steps around the board. That said, I think a lot of systems move the pot, so...go figure.

-Based on what I've read about "wetting" or "tinning" the nozzle on the RPS....and assuming that other systems work similarly...I can't imagine a non-wetted nozzle being any easier. You wouldn't use a non-tinned soldering iron...

cheers, ..rob

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#73061

selective solder process attributes | 13 November, 2014

I have no experience running a "move the board" selective solder so can not compare the 2 methods.....

We have been using an RPS Rhythm "move the pot/nozzle" system since 2008. We are using it solder thru hole components onto boards that often have double sided SMT components. The thru hole pins can be as close as 100 mills to the SMT component pads which then requires precision as to where the nozzle goes. The precision/repeatability of the Rhythm system is good enough to accomplish this.

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#73073

selective solder process attributes | 14 November, 2014

dyoungquist,

I may want to keep your information handy as we bring our Rhythm on line. There's a fair chance we'll have questions about using it!!

cheers, ..rob

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#73074

selective solder process attributes | 14 November, 2014

Thanks for all the remarks. I am tending toward the move the pot method. I am concerned about parts tilting from square if moved or held at an angle. I won't need to deal with board pallets, board clamp mechanisms, etc. Plus I found the moving board machines are more expensive. The RPS looks like a very nice machine, but anything new will be nicer than the ancient Jade we have now.

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#73076

selective solder process attributes | 14 November, 2014

I use a two machines from EBSO, Germany. It's a machines with PCB carrier, so, solder pot is fixed. I'm fully satisfied with this equipment, but I use only wettable nozzles.

If you would like to buy a new machine, not in used condition, EBSO will be a good choice.

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#73077

selective solder process attributes | 14 November, 2014

We use both types in house. We started with a board moving over the pot, slowly moved on to Jade machines and eventually Synchrodex. Like you mentioned without palletizing you'll have component movements during the cylce and most likely won't have the option for top side preheats. Overall I have been very pleased with the Jade's. Keeping the nozzles wetted is a struggle along with the dross from the moving pot, they are very consistent machines.

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