Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Underfill encapsulating passives - Need test

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#72621

Underfill encapsulating passives - Need test | 26 August, 2014

Hi, We have some boards that we apply an underfill to a BGA. Some boards have underfill that covered the surrounding passives. The customer is concerned that the different expansion rates will damage the passives. Does anyone know of a company that could prove out whether the components are safe or not?

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