Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Component FOD / Solder balls

Views: 1576


MGL

#72380

Component FOD / Solder balls | 8 July, 2014

We are experiencing FOD coming off of a Cooper Bussman fuse. The components are dark with a metal like substance. In our testing based on what we were seeing we placed components onto a piece of FR4, placed a drop of flux onto the component and ran them through the reflow. The components came through "clean". We are trying to drive to a source of micro solder balls we are experiencing.Has anyone experienced anything similar?

Attachments:

reply »

Lead Free Wave Solder - 1 Click SMT

Used PCB Equipment - AdoptSMT