Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


IMMERSION GOLD VS HARD GOLD PLATTING

Views: 2016

#71558

IMMERSION GOLD VS HARD GOLD PLATTING | 9 January, 2014

Hi guys,

can somebody explain me why and how immersion gold is better than hard gold platting or vice versa?

We are not going to do any welding operation over the Gold platted area, rather we just move a sliding contact over the gold platter area with respect to a Common terminal so as to get the required signal @ O/P..

Hope above clarification is sufficient for you to understand where I am looking to plate either Hard or Immersion gold platting---Pl advice me which is superior for my application?

reply »

#71563

IMMERSION GOLD VS HARD GOLD PLATTING | 9 January, 2014

Not an expert on Gold Plating, but I would think that if you are making mechanical contact with the gold, that hard gold plating would be better. Immersion plating in this industry is typical for protection of solderable surfaces, and is pretty thin, and would not stand up to repeated sliding contact. Just an opinion. 'hege

reply »

#71565

IMMERSION GOLD VS HARD GOLD PLATTING | 9 January, 2014

For a typical wear surface application [millions of wipes], I agree with hege. You need to be talking electrolytic gold, NOT immersion gold. IPC-2221 says something like ... For edge connectors and areas not to be soldered: * Nickel - 2.5um [~100uin] min [Class 2 & 3]. * Gold - 0.8um [~30uin] min [Class 2], 1.3um [~50uin] min [Class 3].

Words of warning: If you go with electrolytic gold, be aware to put it only on wear surfaces. It'll blank the pooch if you try to solder to it on the non-wear surfaces.

But if you're talking soft membrane switch applications or plug to install applications for LIF or ZIF type connectors ENIG works fine as a connector plating.

reply »

PCB X-Ray Inspection System

ii-feed SMD Intelligent Feeder