IPC-J-STD-001E in regards to Ionic Cleanliness standards states less than 1.56 µg/cm² of total NaCL.
Assuming a typical electronic process which involves smt, wave, and post-hand soldering and uses NO-Clean flux throughout all process, is it typically possible for electronic mfg companies to meet the IPC requirements of less than 1.56 µg/cm² of total NaCL without having to implement a cleaning process?
Yes, providing your: * Inbound material does not compromise your process. * Soldering processes apply the proper amount of flux and activate it properly * Material handling does not contaminate your boards
Recognize that the IPC requirements of less than 1.56 µg/cm² of total NaCl is an anachronism based on rosin flux.