Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


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Underfilm | 30 July, 2013

We are currently experiencing thermal shock failure on a BGA package. We are currently looking at improvements to improve the thermal shock properties by using underfilm. I have seen some studies out there that use this process to improve drop testing analysis. But nothing that definitely proves that it will also improve thermal shock analysis ?? Does anyone have any data to the contrary ?


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