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problem with vapor phase

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problem with vapor phase | 10 July, 2013

hi all,

i have purchased an used vapor phase and i can't make a constant profile.

the profiles depend on the time i wait between two batch... the only difference that i include is the chamber temperature

i don't understand why the chamber temperature is so important for the profile;i thought that is the vapor that make the profile...

any idea why is not stable?

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problem with vapor phase | 10 July, 2013

You wouldn't have a very good profile if you went straight from room temp to vapor temp (_-). The chamber should preheat the board before using vapor to melt the solder.

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problem with vapor phase | 10 July, 2013

Preheating is critical in Vapor Phase Soldering.

One trick that is done is to use the "soft vapor" area just above the soldering vapor, some machines can pause just before going into the soldering vapor. Using that pause above the vapor to continue or augment the preheating is a good thing. Hopefully your machine has, first, a preheater or preheating zone, and secondly, the ability to pause just above the vapor in order to further preheat the board. When we evaluated vapor phase soldering, we wound up with 2-3 minutes in preheat, plus another 45 seconds in the "soft vapor", before dropping into the vapor itself for the soldering. Hope this is of some help. 'hege

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Pete B


problem with vapor phase | 17 July, 2013

What equipment do you have?

As well as the comments from others, another major influencing factor can be the residual heat in your PCB carrier. It takes more heat energy to warm a cold carrier than if it is already hot from the last cycle run. This could explain why you have different profiles depending on the time you wait between cycles.

Hope this is helpful.

Peter B.

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problem with vapor phase | 12 August, 2013

Vapor phase soldering systems by Asscon are characterized by special designed heating modules. The thermal mass of the heating modules is designed so that a completely delay-less and direct regulation of the heat/flow/energy transfer to the soldering component is guaranteed via temperature gradient control. This energy transfer is constantly measured by sensors (dynamic profiling) and automatically regulates according to the requirements of the specific temperature profile (linear or soak). The repeatability of the temperature profile is guaranteed. Using the temperature gradient control, the Asscon vapor phase soldering process occurs without any movement of the component during the heating (up) to peak temperature, and does not interrupt the condensation process by moving in and out of the vapor zone.

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Reflow Ovens thermal process improvement

Used SMT Equipment