Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Micro BGA Rework

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#69248

Micro BGA Rework | 11 June, 2013

We are involved in a project for microBGA SAC rework. The pitch is 0.4mm and the devices are underfilled (softening 150C). The underfill comes off fairly easily but the pressure underneath the package as the underfill softens pushes up on the underside of the package thereby ripping off nearly 80% of the pads after the device is removed. Any ideas?

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#69249

Micro BGA Rework | 11 June, 2013

We are involved in a project for microBGA SAC rework. The pitch is 0.4mm and the devices are underfilled (softening 150C). The underfill comes off fairly easily but the pressure underneath the package as the underfill softens pushes up on the underside of the package thereby ripping off nearly 80% of the pads after the device is removed. Any ideas?

reply »

#69250

Micro BGA Rework | 11 June, 2013

I am not sure that underfill and rework can get along. these boards might be scrap already. You need to get more information about the underfill(manufacturer, supplier...)

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burstd

#69617

Micro BGA Rework | 27 June, 2013

try yincae's SMT 158 capillary underfill. very easy reworking

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#69618

Micro BGA Rework | 27 June, 2013

actually the SMT 88U might even be a better option. super fast cure time at low temperature with easy rework

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