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Bridging from wave under smds such as 8-MSOP-EP, 20-LFCSP-VQ

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Bridging from wave under smds such as 8-MSOP-EP, 20-LFCSP-VQ | 22 February, 2013

Has anyone experienced bridging on topside (solder destination side) surface mount devices after wave soldering? We x-rayed 100% of the placements after smt re-flow with no issues. When the same placements were x-rayed after the tht wave solder process, bridging was evident from thermal planes to leads on nearly every assembly. We have found that a "dollop" of peelable solder mask on the underside of the components provides enough insulation to minimize the issue. Should I work on the wave profile? Is the solder mask a good idea?

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