Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Referee Call on Solder Balls

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#68057

Referee Call on Solder Balls | 31 January, 2013

Need your help with a referee call on solder balls. See attached pictures. Engineering believes the solder balls and splash in pictures violate IPC-A-610E-2010 section 5.2.7.1. Purchasing on the other hand believes these are acceptable. Info: balls and splatter was flicked from surface and would have been dislodged under service conditions. Traces near balls are 0.008 in. Any help wil be greatly appreciatted.

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#68060

Referee Call on Solder Balls | 31 January, 2013

Defect if its not coated.

Defect - Class 1,2,3 • Solder balls are not entrapped, encapsulated or attached or can become dislodged in the normal service environment. • Solder balls violate minimum electrical clearance.

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#68068

Referee Call on Solder Balls | 31 January, 2013

Are the conditions (Bullets) under the IPC Acceptable and Defect sections "ANDs" or "ORs"? In other words, does every condition under a section must be meet to be Acceptable/Defect or meeting any one condition suffices?

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