Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


0402 CHIP WITH GLUE PRINTING PROCESS

FRANKY

#6925

0402 CHIP WITH GLUE PRINTING PROCESS | 18 June, 2001

HI ALL; I WOULD LIKE TO KNOW THAT ANYBODY CAN RUN GLUE PRINTING PROCESS WITH 0402 CHIP AND PASS THEM TO WAVE SOLDERING PROCESS ,PLEASE GIVE ME THE INFORMATION ABOUT THEM . 1)HOW WIDE OF APERTURE DO YOU OPEN ON YOUR STENCIL? 2)HOW MANY YIELD OF THIS PROCESS ESPACIALLY ABOUT DEFECT OF MISSING CHIP 0402 BOTTOM SIDE AND DEFECT OF EPOXY ON PAD? 3)WHEN YOU PASS TO WAVE SOLDER MACHINE ,WHAT IS THE MAIN PROBLEM THAT YOU ARE FECE? 4)HOW MANY YIELD ALONG THE PROCESS ? 5)DO YOU HAVE ANY SUGGESTION FOR THIS PROCESS? REMARK : 1)DON'T COMPARE THIS PROCESS WITH DOUBLE SIDE REFLOW SOLDERING PROCESS. 2)I WILL USE GLUE PRINTING PROCESS AND NOT USE GLUE DOTTING PROCESS.

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#6971

0402 CHIP WITH GLUE PRINTING PROCESS | 18 June, 2001

YA DON NEDA YELL!!! AHYAINT DAFF YANO!!!

Printing adhesive near fine pitch devices can risky. Be careful. Look here to get started: http://www.alphametals.com/products/techarticles/soldrpstncl/guidelines.html [I know this link is expired, but maybe you could find the new one and post it.] http://www.4smt.com/smt/hcmd_smt1.htm http://www.chemical.felpro.com/electronics/tp_multipoint.html

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