Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


LGA Rework

Views: 2044

#67682

LGA Rework | 23 November, 2012

With all of the various techniques available for LGA rework including but not limited to:

Bumping the part using a polyimide stencil http://www.solder.net/products/stencilmate

Bumping the part using a metal fixture or http://www.finetech.de/advanced-rework/applications/rework-of-qfn-mlf.html

Dispensing onto the board using an automated dispense technique http://www.nordson.com/en-us/divisions/efd/products/Industrial-Dispensing-Robots/Pages/default.aspx

or simply paste printing on to the board http://www.soldertools.net/rework-stencils/

what techniques are being used successfully?

Our group likes the bumping of the part technique for LGA rework as it is consistent in solder paste bump deposition, reduces voids compared to the other techniques and provides a slightly higher standoff height for easier cleaning post LGA rework.

Thoughts?

BWET

reply »

Pete B

#67686

LGA Rework | 26 November, 2012

We print paste directly on to the parts then invert, place & reflow using a dedicated I/R rework station. Works well for us on a wide variety of footprints.

reply »

vacuum tweezers - manual pcb assembly