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With all of the various techniques available for LGA rework ...
- Nov 23, 2012
We print paste directly on to the parts then invert, place &...
- Nov 26, 2012
LGA Rework | 23 November, 2012
With all of the various techniques available for LGA rework including but not limited to:
Bumping the part using a polyimide stencil http://www.solder.net/products/stencilmate
Bumping the part using a metal fixture or http://www.finetech.de/advanced-rework/applications/rework-of-qfn-mlf.html
Dispensing onto the board using an automated dispense technique http://www.nordson.com/en-us/divisions/efd/products/Industrial-Dispensing-Robots/Pages/default.aspx
or simply paste printing on to the board http://www.soldertools.net/rework-stencils/
what techniques are being used successfully?
Our group likes the bumping of the part technique for LGA rework as it is consistent in solder paste bump deposition, reduces voids compared to the other techniques and provides a slightly higher standoff height for easier cleaning post LGA rework.
LGA Rework | 26 November, 2012
We print paste directly on to the parts then invert, place & reflow using a dedicated I/R rework station. Works well for us on a wide variety of footprints.
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