Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


MLC reflow using high temp Sn10Pb90 solder balls

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#67609

MLC reflow using high temp Sn10Pb90 solder balls | 8 November, 2012

I am considering using high-temp ball Sn10Pb90 + eutectic solder paste for MLC reflow (no underfill). You can see that there is no Intermetallic bond for the paste and the balls. Under high stress/shock condition, the solder joints develop micro cracks. Besides using LF balls + paste, could you recommend a metallurgy solution for MLC reflow?

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#67624

MLC reflow using high temp Sn10Pb90 solder balls | 12 November, 2012

High-temp ball Sn10Pb90 + eutectic solder paste is common place for MLC reflow. Temperatures necessary to alloy the high-temp ball Sn10Pb90 and eutectic solder would be high enough to compromise interposer, board and many components.

What are your: * High stress/shock conditions? * Eutectic solder alloy? * Process conditions?

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